CertBond // COST Action CA18120 // Reliable roadmap for certification of bonded primary structures
//
Search
Search
Close this search box.
//
Follow us

Working Group 5

Disassembly Phase

Overview

This WG will be concerned with the research related to the joint disassembly procedure for repair and re-use purposes. The objective is to identify and propose a technology that efficiently disassembles bonded parts without damaging them. This technology will be introduced in the case of flaws detection in the manufacturing phase, in case of damage that can be repaired in the in-service phase and in order to re-use parts in the end-life of the product.

Priorities

This WG will perform the following tasks:

  • Task 5.1. Description of the state-of-the-art about disassembly technologies.
  • Task 5.2. Evaluation of the technologies and selection of the most promising technology.

Activities

The WG will meet twice a year, for addressing the above mentioned tasks The WG will organize a Training School in which the disassembly technologies will be explored. In parallel, as the disassembly procedure of adhesively bonded parts is not well-known, emphasis will be given to STSMs where the participants will have the opportunity to gain deep knowledge on that field and disseminate the ‘know-how’ on the scientific community.

Deliverables

The output of the WGs will be reported by participating in international conferences and publication in peer-reviewed journals. In addition to this, the WG will deliver the program of the Training School and will prepare the descriptions of the STSMs.

Members

Dr Damjan KLOBČAR
MC Member
Slovenia
Dr Laurent BERTHE
MC Member
France
Dr Maxime Olive
France
Dr Omer Necati CORA
Turkey
Dr Saverio DE VITO
MC Member
Italy
Dr Sebastian BALOS
MC Substitute
Serbia
Dr Shoshan ABRAHAMI
MC Substitute
Belgium
Dr Uroš TRDAN
MC Member
Slovenia
Prof José SENA-CRUZ
MC Member
Portugal
Prof Konstantinos TSERPES
MC Member
Greece