Working Group 5
This WG will be concerned with the research related to the joint disassembly procedure for repair and re-use purposes. The objective is to identify and propose a technology that efficiently disassembles bonded parts without damaging them. This technology will be introduced in the case of flaws detection in the manufacturing phase, in case of damage that can be repaired in the in-service phase and in order to re-use parts in the end-life of the product.
This WG will perform the following tasks:
- Task 5.1. Description of the state-of-the-art about disassembly technologies.
- Task 5.2. Evaluation of the technologies and selection of the most promising technology.
The WG will meet twice a year, for addressing the above mentioned tasks The WG will organize a Training School in which the disassembly technologies will be explored. In parallel, as the disassembly procedure of adhesively bonded parts is not well-known, emphasis will be given to STSMs where the participants will have the opportunity to gain deep knowledge on that field and disseminate the ‘know-how’ on the scientific community.
The output of the WGs will be reported by participating in international conferences and publication in peer-reviewed journals. In addition to this, the WG will deliver the program of the Training School and will prepare the descriptions of the STSMs.